Next Generation Qualcomm’s Snapdragon 670, 640 and 460 Specs Leaked

Qualcomm’s Snapdragon series of processors powers most modern smartphones. In 2017, smartphones were ruled by chipsets like the Snapdragon 660 and 630. Today, we spotted a leaked image on Weibo showing the specifications of Qualcomm’s mid-range chipsets: Snapdragon 670, Snapdragon 640, and Snapdragon 460.

The biggest change is the processing technology of 670 and 640, which have been upgraded to 10 nm from the 14 nm of SD660 and the SD630. These two now share the 10 nm processing technology of the higher S835 and the S845, along with Samsung Exynos 8895 processors. These will result in more power efficiency in the upcoming chipsets.

As for the graphics department, the  SD670, SD640, and SD460 will carry Adreno 620, 610, and 605 and 2MB and 1 MB of cache, respectively. The SD670 and the SD640 can support two 13 MP dual cameras and one 26 MP camera, whereas the SD460 can support only one 21 MP camera. The upcoming Snapdragon chipsets will also likely consume less power than the previous ones.

Famous leaker Roland Quandt also mentioned the Qualcomm 670 chipset on his Twitter handle @rquandt. He further specifies that the upcoming chipset will support WQHD displays and support up to 64 GB of LPDDR4X RAM. The forthcoming chipset will also keep up to 64 GB of eMMC 5.1 flash storage. He also mentioned that the Snapdragon 670 processor would support up to 22.6 MP rear camera and 13 MP front-facing camera, which is optimal for mid-range smartphones.

Earlier this month, Qualcomm announced their Snapdragon 845 chipset, which includes the Adreno 630 GPU with support for AI frameworks such as Google TensorFlow. It will use eight cores with four high-performance ARM A75 cores and four power-efficient A55 cores. It will support up to 16 MP dual and 32 MP single cameras and slow motion 4K videos at 60 FPS.

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